top of page
Search
Qingzhou Cui
Jan 2, 20205 min read
Photosensitive Polyimide/Polybenzoxazole Part 2: Material Properties
The reason that photosensitive PI/PBO have become the material of choice for semiconductor advanced process is due to many desired...
890 views0 comments
Qingzhou Cui
Dec 2, 20193 min read
The Key to Advanced Packaging Technology – Photosensitive Polyimide/Polybenzoxazole Part 1: Preface
We are living in an unpreceded time with life style never expected by our ancestors. Especially, the high-speed internet and mobile...
859 views0 comments
Qingzhou Cui
Jul 16, 20183 min read
60 Years of Photoresist Materials Part 7: the End of Optical Photolithography and Outlook
After delayed many times, EUV (@13nm) photolithography finally arrived and new EUV steppers from ASML are being installed for major chip...
359 views1 comment
Qingzhou Cui
Jun 19, 20184 min read
60 Years of Photoresist Materials Part 6: DUV 193nm immersion Photoresists and beyond
Following the Moore’s law, 157nm photolithography would be the logic next step after the 193nm dry photolithography. But it turned out...
851 views0 comments
bottom of page