Qingzhou Cui
Photosensitive Polyimide/Polybenzoxazole Part 2: Material Properties
The reason that photosensitive PI/PBO have become the material of choice for semiconductor advanced process is due to many desired...
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Qingzhou Cui
Dec 2, 20193 min read
The Key to Advanced Packaging Technology – Photosensitive Polyimide/Polybenzoxazole Part 1: Preface
We are living in an unpreceded time with life style never expected by our ancestors. Especially, the high-speed internet and mobile...
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Qingzhou Cui
Jul 16, 20183 min read
60 Years of Photoresist Materials Part 7: the End of Optical Photolithography and Outlook
After delayed many times, EUV (@13nm) photolithography finally arrived and new EUV steppers from ASML are being installed for major chip...
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Qingzhou Cui
Jun 19, 20184 min read
60 Years of Photoresist Materials Part 6: DUV 193nm immersion Photoresists and beyond
Following the Moore’s law, 157nm photolithography would be the logic next step after the 193nm dry photolithography. But it turned out...
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Qingzhou Cui
May 21, 20183 min read
60 Years of Photoresist Materials Part 5: DUV 193nm Dry Photoresists
As the IC fabrication came down to 90 nanometer process node, ArF excimer laser (193nm) photolithography became the main stream of...
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Qingzhou Cui
Mar 23, 20183 min read
60 Years of Photoresist Materials Part 4: DUV 248nm Photoresists
The Novalak/DNQ material was such a great photoresist for IC processes that it had dominated the semiconductor industry for over a...
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Qingzhou Cui
Feb 26, 20184 min read
60 Years of Photoresist Materials Part 3: The Age of Novolak/DNQ
When the ≤ 2um resolution was demanded from the semiconductor industry, the KTFR material is no longer a viable option for many IC...
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Qingzhou Cui
Feb 13, 20183 min read
60 Years of Photoresist Materials Part 2: Kodak Thin Film Resist (KTFR)
The first generation commercial photoresist was made by Kodak and branded as “Kodak Thin Film Resist (KTFR)”. It had been the workhorse...
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Qingzhou Cui
Jan 23, 20183 min read
60 Years of Photoresist Materials Part 1: Preface
As the key enabling technology for semiconductor fabrication process, photolithography are behind almost every critical turn of the...
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Qingzhou Cui
Dec 21, 20172 min read
There Is 2.5D before 3D
In the last blog, we have discussed the new material needs and challenges for the 3D packaging and fan-out wafer level packaging...
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Qingzhou Cui
Dec 18, 20172 min read
Material Needs and Challenges for the Current Fan-out Wafer Level Packaging Process
Moore’s Law has guided semiconductor industry for the past 50 years, As the current front end process aims at scales of 10nm and below,...
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